Product Model: 840387-B21
Retail Price: US$6,182.90
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The HPE 840387-B21 is a high-performance processor kit designed for the HPE DL560 Gen10 series. Featuring the robust Intel Xeon-Gold 6152 processor, it operates at a speed of 2.1GHz and includes 22 cores with a thermal design power of 135W. This processor kit ensures advanced computing capabilities and optimal performance for demanding IT environments.
Quick Spec
| Brand | HPE |
| Product ID | 840387-B21 |
| Processor Type | Intel Xeon-Gold 6152 |
| Clock Speed | 2.1 GHz |
| Cores | 22 |
| Thermal Design Power (TDP) | 135W |
Product Manual
- ● High-performance processing with Intel Xeon-Gold 6152
- ● Supports 22 cores for parallel processing
- ● Operates efficiently with a TDP of 135W
- ● Designed for HPE DL560 Gen10 Series
- ● Enhanced reliability and scalability for enterprise environments
Product Applications
- ● Ideal for data centers requiring high processing power
- ● Excellent for virtualization and cloud computing workloads
- ● Suitable for enterprise-level database management and analytics
Supported Options
| High-Performance Memory | HPE 32GB DDR4-2666 ECC Memory Kit |
| Storage Upgrade | HPE 1.92TB NVMe SSD |
| Network Adapter | HPE 10Gb Ethernet Adapter |
Compare to Similar Items
| HPE 826852-B21 | Lower clock speed at 2.0 GHz but higher core count with 24 cores |
| HPE 826894-B21 | Similar cores and TDP but higher clock speed at 2.2 GHz |
| HPE 826548-B21 | Lower cores at 18 but same clock speed of 2.1 GHz |
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840387-B21 Datasheet
840387-B21 Manual | |
| Brand | HPE |
| Model Number | 840387-B21 |
| Product Type | Processor Kit |
| Processor | Intel Xeon-Gold 6152 |
| Processor Base Frequency | 2.1 GHz |
| Total Cores | 22 |
| Thermal Design Power (TDP) | 135W |
| Compatible Server | HPE DL560 Gen10 |
| Cache Memory | 30.25 MB L3 |
| Architecture | 64-bit |
| Instruction Set Extensions | Intel SSE4.2, Intel AVX-512 |
| Max Turbo Frequency | 3.7 GHz |
| Processor Lithography | 14 nm |
| Max Memory Bandwidth | 119 GB/s |
| PCI Express Configurations | Up to 48 Lanes |
| Thermal Monitoring Technologies | Yes |
| Sockets Supported | FCLGA3647 |
| Scalability | 4 or 8 Socket |
| Launch Date | Q4’17 |
| ECC Memory Supported | Yes |